内容标题22

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                Heat sinks(Metal-backed PCB)

                Production since 2003

                Hybrid or Teflon PCB’s

                Bonded to thick Copper pallets ( 1mm – 5mm)

                Large WPNL size

                Experience with Pre-bonded, Post-bonded, Press fit, embedded and various coin designs

                Coin assembly by Bonding film, PSA , Embedded coin & Press fit

                Special team to support NPI and production

                Special team to support NPI and production

                Used in Power amplifiers or RF modules