内容标题35

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                Server Products

                Layer count – up to 34 L

                Maximum thickness – 200mils (5 mm)

                Max panel size 24”x 36” (612 x 916mm)

                Various board types:

                Back panel , Line card, POFV,

                Material Hybrid Technology

                0.94mm Pitch+2Track+Backdrill

                Gold finger and Segmented Gold finger

                Impedance Control, SI, Skip via, Low loss solder mask and Back drilling

                Dual connector and Smaller press fit hole size (0.32 mm)

                Set2dil, Delta L 4.0, VNA measurement capabilities

                0.5mm pitch BGA

                Used for Entry level Server, Blade Server, Rack Server, Hyperscale Server & High performance computing