内容标题14

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                LC(Line Card)

                Up to 40 Layers

                High density designs

                Max thickness 0.180”(4.5mm)

                Max panel size 24X42”(612X1070mm)

                Line/space to 3.0/3.0 mils (76um/76um, inner layers)

                Min core 1.0 mils (25.0um)

                Via in pad (POFV/VIPPO)

                0.2mm drill size

                0.5mm BGA

                Various structure types

                1.N+N;

                2.N+N+N;

                3.N+2+N

                Processes available:

                LDI (Laser Directing Image)

                8 camera post-etch punch

                CCD Back-drilling