内容标题20

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                BP(Backplane)

                Up to 64 layers

                Max thickness .374” (9.5 mm)

                Max panel size 24X48” (612x1219mm)

                M-Tg, Hi-Tg, low Dk/Df materials

                Press fit holes

                Controlled impedance

                Backdrilling Multiple depths, both sides

                BBlind vias, Dual Vias, Air via

                BBlind press-fit holes

                BCover PI-film on the surface

                BImmersion Tin or OSP or ENIG

                Reliability testing Thermal stress, IST, T-260

                Used as backbone of network switches/routers, servers and basestations