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1.Geographical location Hubei(HuangShi)
2.Site Overview
3.Function of Quality Assurance
4.Capability
| Item |
Technology and Capability |
| Layers |
2~14 layers |
| Board thickness |
16mil~126mil(0.4~3.2mm) |
| working panel size.(Max) |
610*712mm (24*28 inch) |
| Material |
Mid-Tg Phenolic & HF, High-TgPhenolic, FR4 & HF FR4,Mid Loss |
| core dielectric thickness (Min) |
3mil(75μm) |
| Line width/spacing |
Inner layer:3mil/3mil(H OZ);Outer layer:3.5mil/3.5mil(Copperfoil H OZ) |
| Inner layer copper thickness(Max) |
5 OZ |
| Drilling Hole Diameter (Min) |
0.20mm |
| Aspect ratio (DHS) (Max) |
12:1 |
| Outer Layer Process |
Pattern plating |
| Surface Metal Finish |
ENIG，OSP，HASL(leaded),GoldFinger,ENIG+OSP,OSP+GoldFinger |
| Special Process |
Back Drilling,POFV,Buried Vias,Segmented Gold Finger ,etc |
5.Technology Support
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