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                BP(Backplane)
                        - 最高层数: 56层
                        - 最大ζ 生产尺寸: 26" X 38" (660mm X 965mm)
                        - 最大出货尺寸: 24.4" X 36.4" (620mm X 925mm)
                        - 最高板厚: .3937" (10mm)
                        - 背钻工艺 (Backdrilling, Counter Bore, Depth Controlled Drilling; 单面背钻, 双面背钻, 多种深度)
                        - 插件孔 (Press Fit Hole)
                        - 阻抗控制 (Controlled Impedance)
                        - 高玻璃态转变温度∞板材 (High Tg Laminate)
                        - 高速低损耗ω板材: High Speed (Low DK), Low Loss (Low Df) Laminate
                        - 广泛应用于网络转换器↑, 路由器, 服务器和工作基站等


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